Dynova
Dynova
Explore our elite inventory of high-density rack servers, GPU acceleration nodes, and robust storage solutions designed for massive CDN data throughput.
Pioneering excellence in hardware manufacturing, cloud edge computing, and high-performance server solutions since 2017.
Dynova AI Systems Inc. is a professional manufacturer specializing in high-performance AI GPU servers, GPU workstations, and customized computing infrastructure for AI training, AI inference, HPC, cloud computing, and enterprise data centers. Since our establishment in 2017, we have been committed to delivering reliable, scalable, and energy-efficient GPU computing solutions to customers worldwide.
Our modern manufacturing facility covers 23,800 m², integrating advanced production lines, assembly workshops, aging test laboratories, and strict quality control processes to ensure every server meets international standards. With an annual export revenue of approximately USD 28 million, Dynova has built strong partnerships with distributors, system integrators, AI solution providers, universities, research institutes, and enterprise customers across global markets.
Supported by 8 years of export experience and 9 years of industry expertise, we continuously invest in research and development to provide innovative GPU server platforms compatible with leading NVIDIA and AMD accelerator technologies. Our experienced engineering team enables flexible ODM and OEM services, allowing customers to customize CPU platforms, GPU configurations, memory, storage, networking, chassis, cooling systems, branding, and software integration.
Quality is at the core of everything we do. Our products undergo 100% functional testing, burn-in testing, thermal performance verification, compatibility validation, and reliability testing before shipment. A dedicated quality assurance team of 58 inspectors ensures every product delivers consistent performance and long-term stability.
Dynova maintains close cooperation with more than 1,260 supply chain partners, enabling efficient procurement, rapid production, and reliable global delivery. Last year, our R&D team successfully launched 186 new products, supported by 142 experienced R&D engineers focused on next-generation AI computing technologies.
Addressing worldwide industrial demands with robust edge caching architectures, ultra-low latency routing, and high-density compute clusters.
Modern Content Delivery Networks (CDNs) require extreme I/O throughput, high memory bandwidth, and distributed edge servers to minimize latency for global users. Enterprises are transitioning to custom rack-mount architectures to handle multi-terabit traffic loads seamlessly.
Dynova delivers turnkey server infrastructure tailored for telecommunications, cloud providers, and digital media giants. Our hardware is engineered to support seamless scaling, virtualization, and high-speed NVMe storage arrays.
From bespoke chassis design and proprietary BIOS firmware integration to custom thermal solutions and liquid cooling integration, our R&D team collaborates closely with global partners to build hardware matching exact specifications.
Anticipating technological shifts with PCIe Gen5 architecture, liquid cooling systems, and decentralized AI inference networks.
As data consumption surges with generative AI and 8K video streaming, standard air-cooled servers face thermal limits. Dynova’s R&D roadmap emphasizes advanced liquid cooling integration, high-density PCIe Gen5 slots, and high-efficiency power supplies designed for sustainable data center operations.
Navigating global trade and regional compliance requires strict adherence to international safety, electromagnetic, and environmental standards (CE, FCC, RoHS, ISO9001). Dynova provides complete certification documentation and localized firmware tuning to ensure seamless deployment across North America, Europe, and Asia-Pacific markets.
Expert answers regarding our OEM/ODM server manufacturing, global shipping, and custom hardware engineering services.
Complete your infrastructure ecosystem with high-performance memory modules, enterprise hard drives, and specialized server sub-assemblies.
