Dynova
Dynova
In the era of Generative AI and Large Language Models (LLMs), the global data center landscape is undergoing a paradigm shift. Traditional in-house server rooms are rapidly evolving into sophisticated "Collocation Services" models. As a leading CE Certified Collocation Services Factory and Exporter, we recognize that modern enterprises no longer just seek space; they demand a robust ecosystem comprising high-density power, advanced cooling, and ultra-low latency connectivity.
According to recent industry analysis, the Global Colocation Market is projected to grow at a CAGR of 14.5% through 2030. This growth is fueled by the explosion of data from 5G, IoT, and high-performance computing (HPC) requirements. For global enterprises, the "Build vs. Buy" dilemma has shifted heavily toward collocation due to the specialized infrastructure required for GPUs like the NVIDIA H100 and B200, which consume significantly more power and generate higher heat than traditional CPU-based systems.
Modern collocation environments must support 20kW+ per rack, a standard we integrate into every server chassis design.
Transitioning from air cooling to liquid-cooled integrated solutions to ensure 99.999% uptime for AI training.
CE certification ensures that our exported equipment meets rigorous European safety, health, and environmental protection requirements.
Why do global tech giants look toward China for collocation hardware? It comes down to Supply Chain Synergy and Engineering Density. At Dynova AI Systems Inc., we leverage a network of over 1,260 supply chain partners. This allows us to move from prototype to mass production faster than any other region in the world.
Our 23,800 m² facility is not just a factory; it is an innovation hub. With 142 experienced R&D engineers, we focus on thermal optimization and BIOS/firmware security. In the last year alone, we released 186 new products, catering to the specific needs of data centers in North America, Western Europe, and Southeast Asia. The efficiency of the Chinese manufacturing model reduces the Total Cost of Ownership (TCO) for our clients by approximately 25-30% while maintaining premium quality standards.
Established in 2017, Dynova AI Systems Inc. has cemented its reputation as a premier manufacturer of high-performance AI GPU servers and GPU workstations. Our authority is built on 9 years of industry expertise and a relentless focus on quality assurance. We don't just assemble; we engineer. Every unit undergoes 100% functional testing, thermal performance verification, and reliability testing.
As we move into 2025, the demand for DeepSeek-ready infrastructure and Data AI computer servers is skyrocketing. The next generation of collocation services will be defined by "Intelligence at the Edge." This means server hardware must be more compact, more powerful, and capable of operating in diverse environmental conditions.
We are currently developing "Short Depth" OEM servers for telecommunication racks and cooling-optimized GPU storage solutions. Our R&D team is also exploring AI-driven DCIM (Data Center Infrastructure Management) compatibility, allowing our servers to communicate directly with facility cooling systems to optimize power usage effectiveness (PUE).
Specialized workstations optimized for real-time inference and localized LLM deployment.
Short-depth chassis designs for space-constrained collocation environments.
Energy-efficient PSU (Power Supply Units) with 80 Plus Platinum and Titanium certifications.
CE marking indicates that our products comply with the essential requirements of relevant European health, safety, and environmental protection legislation. For exporters and data center operators, this ensures the equipment is safe for use in all EU member states and meets international rigorous electronic standards.
Our 142 R&D engineers work closely with clients to customize CPU platforms, GPU configurations (NVIDIA/AMD), memory (DDR4/DDR5), and chassis dimensions. We can also provide private label branding and specialized firmware for unique security protocols.
Due to our robust supply chain of 1,260+ partners, standard configurations are usually ready for shipment within 2-4 weeks. Custom ODM projects typically range from 6-10 weeks depending on the complexity of the hardware design.
Absolutely. Our latest FusionServer and xFusion series are specifically engineered with high NVMe storage throughput and PCIe Gen 5 support, making them ideal for training and inferencing the latest AI models including DeepSeek, OpenAI models, and more.
