Dynova
The modern datacenter environment requires complete separation of the networking control plane from the underlying physical forwarding hardware. As a leading OEM/ODM Software-Defined Networking manufacturer and exporter, Dynova AI Systems Inc. provides high-performance computing components, SmartNICs, white-box servers, and virtualization-ready systems that form the structural foundation of modern enterprise networks.
Since our inception in 2017, we have committed ourselves to manufacturing server and networking hardware that supports advanced virtualization, high bandwidth, and low-latency workloads. Our 23,800 m² state-of-the-art facility integrates automated circuit assembly, system testing, thermal verification, and strict quality control protocols to supply critical hardware architectures globally.
Equipped with advanced SMT lines, structural assembly yards, and high-temp burn-in chambers.
Specializing in UEFI/BIOS adaptation, thermal mechanical layout, and high-speed signal integrity.
Supplying hyperconverged nodes, GPU systems, and storage arrays to critical global markets.
Deep technical knowledge in server architecture design, board layout, and BIOS optimization.
Ensuring consistent access to premium controllers, high-speed RAM, components, and raw materials.
Annually developed to meet shifting technical standards for compute power, storage, and networking.
| Feature Group | Standard Offering | OEM/ODM Customization Scope |
|---|---|---|
| Boot & Controller Cards | SAS3808 / M.2 RAID Controllers | Firmware branding, PCIe configuration, BIOS virtualization parameters |
| White-Box Servers | 1U / 2U Standard Chassis | Backplane modifications, smart cooling channels, customer logic placement |
| Networking Adaptors | 10GbE / 25GbE / 100GbE NICs | SmartNIC/DPU processor integrations, custom drivers, interface layouts |
| System Management | IPMI 2.0 / Redfish BMC | Custom OpenBMC configuration, Edge Band API endpoints, customer web UI |
Global procurement teams in the hyper-scale datacenter, telecom, and cloud space face unique structural hurdles. Vendor lock-in, proprietary management layers, and rigid physical layouts restrict scalability and inflate Total Cost of Ownership (TCO). Procurement managers look for SDN white-box systems that offer the flexibility to install third-party operating systems (such as SONiC or ONL) while providing highly reliable underlying hardware.
Dynova addresses these concerns through custom BIOS configurations, modular network interface adapters, and robust storage expansion layouts. By maintaining strict control over our component supply chain, we deliver consistent hardware revisions, guaranteeing long lifecycle support and hassle-free deployments across globally distributed server clusters.
The industry is experiencing a transition from traditional static ASICs to dynamic, software-programmable data planes. High-performance computing nodes, artificial intelligence clusters, and massive storage pools require line-rate packet processing without taxing host CPUs. This shift is characterized by key technological advancements:
Dynova utilizes China’s advanced electronics manufacturing ecosystem to deliver significant advantages for global partners. Located in an area with a dense concentration of components and engineering talent, our factory guarantees short development periods, high manufacturing precision, and competitive pricing.
By coordinating with more than 1,260 supply chain partners, we source capacitors, high-density PCBs, and controller ASICs directly. This structured approach reduces typical lead times for complex SDN server builds from several months to just a few weeks, while protecting against component shortages.
Every boot card, switch module, and server node undergoes dynamic workload testing under elevated temperatures before export.
Executing multi-stage inspections, including AOI, visual checking, structural validation, and signal testing.
Operating a global network means navigating complex regional compliance structures, security standards, and local deployment requirements. Dynova ensures all shipped SDN products meet the legal and operational standards of Western Europe, North America, Southeast Asia, and Australia.
Custom SDN and virtualization hardware can be configured for a variety of demanding workloads, including cloud management, high-performance computing, and edge system topologies.
Deploying short-depth servers equipped with hardware-based RAID boot cards (like the XP270-M2). These systems manage local traffic, run virtualization environments, and route data back to central datacenters over secure VPN tunnels.
Using SDN controllers to isolate server arrays dynamically. Hypervisors offload virtual switch logic to physical SmartNICs, keeping raw CPU cores focused on driving customer workloads.
Linking high-performance GPU systems via low-latency networks. RDMA over Converged Ethernet (RoCEv2) allows GPUs to access remote memory pools directly, eliminating software network overhead.
Dynova AI Systems Inc. is a professional manufacturer specializing in high-performance AI GPU servers, GPU workstations, and customized computing infrastructure for AI training, AI inference, HPC, cloud computing, and enterprise data centers. Since our establishment in 2017, we have been committed to delivering reliable, scalable, and energy-efficient GPU computing solutions to customers worldwide.
Our modern manufacturing facility covers 23,800 m², integrating advanced production lines, assembly workshops, aging test laboratories, and strict quality control processes to ensure every server meets international standards. With an annual export revenue of approximately USD 28 million, Dynova has built strong partnerships with distributors, system integrators, AI solution providers, universities, research institutes, and enterprise customers across global markets.
Supported by 8 years of export experience and 9 years of industry expertise, we continuously invest in research and development to provide innovative GPU server platforms compatible with leading NVIDIA and AMD accelerator technologies. Our experienced engineering team enables flexible ODM and OEM services, allowing customers to customize CPU platforms, GPU configurations, memory, storage, networking, chassis, cooling systems, branding, and software integration.