Dynova
Dynova
Dynova AI Systems Inc. is a professional manufacturer specializing in high-performance AI GPU servers, GPU workstations, and customized computing infrastructure for AI training, AI inference, HPC, cloud computing, and enterprise data centers. Since our establishment in 2017, we have been committed to delivering reliable, scalable, and energy-efficient GPU computing solutions to customers worldwide.
Supported by 8 years of export experience and 9 years of industry expertise, we continuously invest in research and development to provide innovative GPU server platforms compatible with leading NVIDIA and AMD accelerator technologies. Our experienced engineering team enables flexible ODM and OEM services, allowing customers to customize CPU platforms, GPU configurations, memory, storage, networking, chassis, cooling systems, branding, and software integration.
Our modern manufacturing facility covers 23,800 m², integrating advanced production lines, assembly workshops, aging test laboratories, and strict quality control processes to ensure every server meets international standards. With an annual export revenue of approximately USD 28 million, Dynova has built strong partnerships with distributors, system integrators, AI solution providers, universities, research institutes, and enterprise customers across global markets.
Dynova maintains close cooperation with more than 1,260 supply chain partners, enabling efficient procurement, rapid production, and reliable global delivery. Last year, our R&D team successfully launched 186 new products, supported by 142 experienced R&D engineers focused on next-generation AI computing technologies.
As artificial intelligence models evolve from BERT and GPT architectures to complex Reasoning Models like DeepSeek, global data centers face unprecedented computing bottlenecks. High-density servers and robust hardware fabrics are now the bedrock of digital transformation.
Hyperscalers and global enterprises require modular high-density server configurations. High-performance dual-socket Intel Xeon and AMD EPYC platforms are critical for running heavy multi-tenant cloud applications.
Generative AI training, fine-tuning, and LLM inference require optimized GPU servers. The industry is shifting from traditional CPU setups to dedicated AI multi-GPU clusters featuring interconnected fabrics like NVLink and RoCE v2.
High-speed data transfer between CPUs, GPUs, and network adaptors is crucial. Standard implementations now mandate PCIe Gen 5 networks, DDR5 ECC memory, and 32Gb/s Emulex HBA fabrics to minimize node latency.
Operating in China's premier technology hardware hub enables Dynova AI Systems to leverage deep industrial ecosystems, high production agility, and unmatched cost-performance structures.
Our raw material and semiconductor components are sourced directly from our network of over 1,260 certified supply chain partners. This robust system guarantees continuous component access, protecting deployments from global supply chain disruptions.
Quality is core to our operations. Our 58 dedicated inspectors enforce a 100% functional verification workflow: pre-assembly components testing, high-temperature dynamic burn-in testing, thermal performance validation, and platform compatibility testing.
With 142 R&D engineers, we adapt base chassis setups to meet bespoke requirements. We configure memory, storage, custom BIOS, thermal management solutions, and specialized network interface controllers to fit our clients' systems.
| Testing Phase | Inspection Process & Equipment Used | Target Metric / Quality Benchmark |
|---|---|---|
| Functional Testing | Automated BIOS check, interface electrical diagnostics, and component validation. | 100% hardware functionality and basic input/output integrity. |
| Burn-in Testing | Continuous system stress testing at 45°C under maximum workload load for 48-72 hours. | Identification of early semiconductor failures and system infant mortality. |
| Thermal Performance | Flir infrared thermography and internal hardware sensor monitoring during operations. | Zero thermal throttling; optimal airflow vectors across processor heatsinks. |
| Compatibility Validation | Multi-OS deployment tests (RedHat Enterprise Linux, CentOS, Windows Server, VMware ESXi). | Kernel stability, driver integration, and platform hypervisor support. |
| Reliability Verification | Vibration testing and mechanical shock analysis replicating shipping and datacenter environments. | Structural chassis integrity and connection retention. |
Computing needs vary across regions and sectors. Dynova's modular platform design ensures performance is optimized for targeted real-world applications.
Our GPU rack servers, including the G8600 V7 and G5200 series, are designed for the high bandwidth required to train large language models. Built-in high-speed interconnects facilitate efficient tensor parallelism and speed up deep learning workloads.
Hardware Recommendation: G8600 V7 / 2258 V7Deploying data processing nodes near IoT networks reduces network costs. Our 1U/2U server platforms deliver the compute density and rugged construction needed for regional edge locations and smart city analytics.
Hardware Recommendation: 1288H V6 / R650 1UHigh-performance computing (HPC) setups depend on low-latency connections and memory configurations. Combining Intel Xeon processing cores with high-speed DDR5 ECC memory enables stable, high-throughput simulation runs.
Hardware Recommendation: 2288H V6 / DDR5 RDIMMWe track semiconductor trends to keep our computing products ready for future data center requirements.
Integrating direct-to-chip cold plate liquid cooling into 2U and 4U GPU servers to handle high thermal design power (TDP) setups exceeding 500W per node.
Developing motherboard layouts supporting PCIe Gen 6 and Compute Express Link (CXL) 3.0, enabling pooled memory architectures and high-speed device communication.
Optimizing firmware, BIOS parameters, and system drivers for Mixture-of-Experts (MoE) workloads, improving processing efficiency for advanced reasoning algorithms.
Designing power supplies with Titanium-grade energy efficiency (96%+) to help enterprise customers meet green building and sustainability requirements.
Deploying hardware worldwide requires compliance with international safety, environmental, and engineering standards. Dynova's quality management systems are ISO 9001 and ISO 14001 certified.
All exported servers are certified to meet CE, FCC, RoHS, and UL specifications, ensuring seamless deployment in enterprise data centers across North America, Europe, and the APAC region.
Additionally, we provide localization services, including custom BIOS/IPMI firmware configurations, regional parts distribution networks, and remote support from engineers to resolve technical issues quickly.
A visual look at Dynova's production floor, testing labs, and component logistics operations.
