Dynova
Dynova
In the rapidly evolving landscape of heterogeneous computing, xFusion has emerged as a titan in providing high-density server solutions. Originally spun off from Huawei’s server business line, xFusion has inherited decades of R&D excellence, positioning itself as a primary "China Best xFusion Networking Factories & Supplier" for global enterprises. Today, the industrial status of xFusion is not merely about hardware assembly; it represents the pinnacle of intelligent computing power supply.
xFusion currently serves over 130 countries, providing the backbone for Tier-1 data centers. Its FusionServer series is renowned for its reliability in telecommunications and banking sectors.
Transitioning from V6 to V7 architectures, xFusion focuses on PCIe 5.0 integration, DDR5 memory support, and liquid-cooling modules to handle AI models like DeepSeek R1.
Adhering to "Green Computing," new factory standards prioritize PUE (Power Usage Effectiveness) reduction through intelligent airflow management and high-efficiency PSUs.
From the industrial parks of Shenzhen to the tech hubs of North America, xFusion products are tailored for specific verticals:
Dynova AI Systems Inc. is a professional manufacturer specializing in high-performance AI GPU servers, GPU workstations, and customized computing infrastructure. Since our establishment in 2017, we have been committed to delivering reliable, scalable, and energy-efficient GPU computing solutions to customers worldwide.
Supported by 8 years of export experience and 9 years of industry expertise, we continuously invest in research and development to provide innovative GPU server platforms compatible with leading NVIDIA and AMD accelerator technologies. Our experienced engineering team enables flexible ODM and OEM services, allowing customers to customize CPU platforms, GPU configurations, memory, storage, and networking.
As a leading supplier in the China networking ecosystem, Dynova and its partners are charting a path toward Autonomous Computing. The roadmap includes:
Future xFusion and Dell PowerEdge iterations will feature deeper integration with LLM-specific accelerators. We are optimizing our 2U and 4U chassis designs to accommodate the increasing thermal design power (TDP) of next-gen GPUs, ensuring that systems like the FusionServer 2288H V7 can operate at peak performance without throttling.
By 2026, air cooling will hit its physical limits for high-density AI clusters. Our R&D team is pioneering cold-plate liquid cooling solutions that integrate directly with xFusion server architectures, reducing data center energy consumption by up to 40%.
Networking is no longer just about the NIC. We are implementing NVMe-over-Fabrics (NVMe-oF) technologies across our EP600 Series SSDs to eliminate I/O bottlenecks in Deep Learning clusters, providing a seamless data path between storage and compute nodes.
